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HongJin-T5100 two-component addition type high thermal conductivity silicone

T5100.jpg


Brief introduction


model

HongJin-T5100

Specification

2600ml/branch

characteristic

HongJin-T5100 is a two-component addition type high thermal conductivity potting compound. It is heated and cured, and the higher the temperature, the faster the curing. This product does not produce any by-products in the curing reaction, and can be applied to the surface of PC (Poly-carbonate), PP, ABS, PVC and other materials and metal surfaces, and can be used in the environment of -40 ℃ to 200 ℃.

Applicable Products

Potting heat dissipation protection for power modules; Potting heat dissipation protection for other electronic components


Technical parameter


technical parameterAcomponentBcomponent
Before curingExteriorlight blue fluidPlatinum Fluid
Viscosity(cps)10000~2000012000~20000
The mixing ratioA:B(cps)1:1
Viscosity after mixing(cps)10000~10000
Room temperature applicable time(min)60~90
Room temperature molding time(h)3~6
After curinghardness(ShaoA)35~65
Thermal Conductivity(W/M·K)≥2.0
Dielectric strength(KV/mm)≥13
Dielectric constant(1.0MHz)2.8~3.3
Volume resistivity(Ω·cm)≥1.0×1013
proportion2.5±0.5


Precautions

                             

1、Organotin compounds and other organometallic compounds.

2、Silicone rubber containing organotin compounds.

3、Sulfur, polysulfides, polysulfones and other sulfur-containing materials.

4、Amines, urethanes, or other amine-containing materials.

5、Unsaturated hydrocarbon plasticizer.

This product needs to be stored in a ventilated and cool place below 30℃. When using it for the first time, the colloid of each component should be stirred evenly in advance to prevent uneven sedimentation of the components, and then fully mixed according to the specified proportion. Vacuum degassing is required when adding to the product. Care should be taken to avoid contact with the following substances during use. 

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